We are seeking a highly skilled and motivated MEMS Process Integration Engineer to join our rapidly growing engineering team. In this critical role, you will be instrumental in the development, optimization, and integration of cutting-edge MEMS wafer fabrication processes. Working in a cleanroom environment, you will troubleshoot complex process issues, drive yield improvements, and contribute creatively to bringing innovative MEMS products from concept to high-volume manufacturing. This is a career-oriented, journey-level position for a seasoned professional looking to make a significant impact.

Knowledge: Having broad expertise or unique knowledge, uses skills to contribute to development of company objectives and principles and to achieve goals in creative and effective ways. 

Job Complexity:  Works on significant and unique issues where analysis of situations or data requires an evaluation of intangibles.  Exercises independent judgment in methods, techniques and evaluation criteria for obtaining results. Creates formal networks involving coordination among groups.

Supervision: Determines methods and procedures on new or special assignments.  May supervise the activities of others. 

Experience:  Typically requires a minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree, or PhD with 3 years of experience or equivalent.

 
ESSENTIAL JOB FUNCTIONS:

• Process Ownership & Development: Own, manage, and drive technical programs and projects related to MEMS process integration. Develop, optimize, and maintain comprehensive process flows to ensure superior product performance, yield, and reliability.
• Cross-Functional Collaboration: Collaborate extensively with design, process, equipment, and manufacturing engineers to define and implement robust process integration strategies and methodologies. Interface with external customers and partners as needed.
• Wafer Management & Analysis: Manage and process wafers/lots through integrated fabrication lines. Collect, analyze (using statistical methods like DOE, SPC, JMP), and interpret on-wafer metrology data to identify trends, troubleshoot issues, and ensure process stability and yield targets are met.
• Troubleshooting & Improvement: Proactively identify and correct problems in MEMS devices and fab processes using experimental methods. Drive continuous improvement initiatives to reduce defects, minimize variations, and optimize cycle time.
• Documentation & Knowledge Transfer: Develop and maintain thorough process integration documentation, including process flows, specifications, and Standard Operating Procedures (SOPs). Present findings and strategies clearly to technical teams and management.
• Innovation & Industry Awareness: Stay abreast of the latest advancements and industry trends in semiconductor and MEMS process integration, applying this knowledge to drive innovation and enhance existing processes.
• Yield & Cost Optimization: Collaborate closely with foundry teams to achieve yield targets, reduce costs, and improve overall manufacturing efficiency. Deliver New Product Introduction (NPI) projects on schedule.

Job Requirements *

QUALIFICATIONS:
To perform this job successfully, an individual must be able to perform each essential job function satisfactorily. The requirements listed below are representative of the knowledge, skill, and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

REQUIRED:

• Education: Degree in Material Science, MEMS, Material Engineering, Chemistry, Physics, Applied Physics, Electrical Engineering, or a closely related engineering/scientific field.
• Experience:
• Minimum of 8 years of hands-on experience in semiconductor or MEMS fabrication, characterization, or metrology.
• Proven experience in wafer fab environments, including dry etch, wet etch, photo, plating, metallization, grind, and measurement processes.
• Demonstrated experience in process integration, preferably within an R&D or high-volume manufacturing setting.
• Technical Skills:
• Knowledge of semiconductor/MEMS module processes including lithography, etch, deposition, electroplating, CMP, wet clean, and inline/failure analysis metrology.
• Knowledge of statistical data analysis and process optimization/control techniques (e.g., Design of Experiments (DOE), Statistical Process Control (SPC), Capability Analysis, FMEA, JMP software).
• Strong problem identification and analytical skills.
• Communication & Collaboration:
• Excellent written, verbal, and presentation skills to effectively communicate complex technical information to peers, management, and cross-functional teams (both face-to-face and via remote meetings).
• Ability to work independently with minimal supervision and as a collaborative team player.

Work Environment: Ability to work effectively in a cleanroom environment, requiring gowning (smock, hood, gloves, booties, etc.).

DESIRED:

• Experience in MEMS process integration from concept to finished product.
• Familiarity with layout files (industry-standard such as GDS and OASIS) and the photomask tape-out procedure.
• Experience with MEMS devices such as inkjet printheads, resonators, sensors, or actuators, including electro-mechanical device modeling and analysis; piezoelectric material property evaluation; thin film material processing and characterization; and failure analysis.
• Experience with Piezo MEMS or other MEMS devices incorporating complex fluidic, electrical, and packaging designs.
• Experience with MEMS design tools (e.g., SolidWorks or AutoCAD, MEMS layout tools like dw-2000 or Tanner L-edit).
• Experience with Python or MATLAB computing software.

PHYSICAL DEMANDS:
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

• Primarily involves standing, walking, for up to half of the time.
• Sitting for one-third to two-thirds of the time.

WORK ENVIRONMENT:
The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Works primarily in a wafer fabrication and cleanroom environment, requiring cleanroom gowning. Potential exposure to stored energy hazards (electricity, compressed gases), moderate noise levels, and potentially hazardous chemicals in accordance with defined safety practices (requiring initial and recurring training).

OTHER:

• Other manufacturing and/or administrative duties as may be assigned.
• Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.

FUJIFILM Dimatix, Inc. provides competitive wages, a generous benefits package and a friendly, dynamic working environment.

Equal Opportunity Employer

Fujifilm is an E-Verify Employer